Method of patterning electroless plated metal on a polymer subst

Details Method of patterning electroless plated metal on a polymer subst Method of patterning electroless plated metal on a polymer subst

1990-03-13

1991-01-01

Silverman, Stanley

Coating processes

Electrical product produced

Welding electrode

156628, 427 48, B03D 306

Patent

active

049817159

ABSTRACT:
A method is described for patterning electroless plated metal on a polymer substrate. A substrate is first coated with a polymer suitable for complexing noble metal compounds. The substrate is then complexed with a noble metal compound, such as containing palladium, selectively irradiated to form the desired conductor pattern, and then etched so that the desired pattern remains. The substrate is subsequently placed in an electroless plating bath to form a metal pattern. Alternatively, before applying the noble metal compound, a substrate immersed in a polymer solution suitable for complexing a noble metal compound can be selectively irradiated to selectively deposit polymer on the substrate, followed by applying a noble metal compound and an electroless plating bath.

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