Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2011-04-19
2011-04-19
Tucker, Philip C (Department: 1745)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S234000, C156S272800, C156S273300, C156S290000
Reexamination Certificate
active
07927454
ABSTRACT:
A method of forming a metallic material on a receptor that includes the steps of: placing a donor element proximate a receptor, wherein the donor element includes a donor substrate and a thermal transfer layer, wherein the thermal transfer layer includes a catalytic material, and wherein the thermal transfer layer of the donor element is placed proximate the surface of the receptor; thermally transferring at least a portion of the thermal transfer layer from the donor element to the receptor; and electrolessly depositing a metallic material on the receptor by growth of the metallic material on the catalytic material.
REFERENCES:
patent: 4252671 (1981-02-01), Smith
patent: 4722583 (1988-02-01), Stewart
patent: 4833124 (1989-05-01), Lum
patent: 4912083 (1990-03-01), Chapman
patent: 4940640 (1990-07-01), MacDiarmid
patent: 4942141 (1990-07-01), DeBoer
patent: 4948776 (1990-08-01), Evans
patent: 4948778 (1990-08-01), DeBoer
patent: 4950639 (1990-08-01), DeBoer
patent: 4952552 (1990-08-01), Chapman
patent: 4985321 (1991-01-01), Chou
patent: 5023229 (1991-06-01), Evans
patent: 5024990 (1991-06-01), Chapman
patent: 5084299 (1992-01-01), Hirsch et al.
patent: 5089362 (1992-02-01), Chou
patent: 5156938 (1992-10-01), Foley
patent: 5166024 (1992-11-01), Bugner
patent: 5256506 (1993-10-01), Ellis et al.
patent: 5286604 (1994-02-01), Simmons
patent: 5322275 (1994-06-01), Gardellini
patent: 5322751 (1994-06-01), Chou
patent: 5332646 (1994-07-01), Wright et al.
patent: 5340699 (1994-08-01), Haley
patent: 5351617 (1994-10-01), Williams
patent: 5360694 (1994-11-01), Thien
patent: 5401607 (1995-03-01), Takiff
patent: 5691098 (1997-11-01), Busman
patent: 5725989 (1998-03-01), Chang
patent: 5747217 (1998-05-01), Zaklika
patent: 5756689 (1998-05-01), Busman
patent: 6030550 (2000-02-01), Angelopoulos
patent: 6194119 (2001-02-01), Wolk
patent: 6228555 (2001-05-01), Hoffend
patent: 6284425 (2001-09-01), Staral
patent: 6468715 (2002-10-01), Hoffend
patent: 6521324 (2003-02-01), Debe et al.
patent: 6586153 (2003-07-01), Wolk
patent: 6866979 (2005-03-01), Chang
patent: 2003/0138555 (2003-07-01), Debe et al.
patent: 2004/0224252 (2004-11-01), Kondo et al.
patent: 2005/0022692 (2005-02-01), Eu
patent: 2005/0153078 (2005-07-01), Bentley
patent: 2006/0121316 (2006-06-01), Tomka et al.
patent: 321 923 (1989-06-01), None
patent: 568 993 (1993-10-01), None
patent: 9-255774 (1997-09-01), None
patent: WO 97/33193 (1997-09-01), None
patent: WO 2005/079126 (2005-08-01), None
Applied Surface Science 96-98 (1996) 399-404, Decomposition Mechanisms of Thin Palladium Acetate Film with Excimer UV Radiation.
Applied Surface Science 109-110 (1997) 253-258, Excimer Laser-Induced Surface Activation of Alumina for Electroless Metal Deposition.
Applied Surface Science 54 (1992) 465-470, UV-Induced Decomposition of Absorbed Cu-acetylacetonate Films at Room Temperature for Electroless Metal Plating.
The Electrochemical Society, Inc., Modern Electroplating, Fourth Edition, Schlesigner et al.
American Electroplaters' Society, Electroplating, pp. 406-409.
Wolfgang Riedel, Electroless Nickel Plating, pp. 5-6 (1989).
LITI Electroless Search Summary, pp. 1-7.
Bellmann et al., Chem. Mater 10, pp. 1668-1678 (1998).
Bayerl et al., Macromol. Rapid Commun. 20, pp. 224-228 (1999).
Beilo, K.A. et al., J. Chem. Soc. Chem. Commun., 1993, 452-454 (1993).
Applied Surface Science 86 (1995) 202-207, New Approach of a Laser-Induced Forward Transfer for Deposition of Patterned Thin Metal Films.
Huynh Khanh T.
Isberg Thomas A.
Stay Matthew S.
Tolbert William A.
Wolk Martin B.
Christie Parker & Hale LLP
Mazumdar Sonya
Samsung Mobile Display Co., Ltd.
Tucker Philip C
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