Method of patterned metal reflow on interconnect substrates

Details Method of patterned metal reflow on interconnect substrates Method of patterned metal reflow on interconnect substrates

1990-11-15

1992-06-23

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427123, 427124, 427125, 427 96, 427 531, C23C 1600

Patent

active

051241757

ABSTRACT:
Solder reflow on an electrical interconnect substrate between a plurality of electrical contacts. The method includes coating the contacts with tin/lead solder, depositing a wetting metal between the contacts, and heating the substrate to at least the melting point of the solder so that the solder melts, reflows across the wetting metal and connects or links the contacts. The entire surface of a customizable copper/polyimide substrate can be personalized by solder links and TAB leads from surface-mounted integrated circuits can simultaneously be soldered to the substrate.

REFERENCES:
patent: 3855693 (1974-12-01), Umbaugh
patent: 4034468 (1977-07-01), Koopman
patent: 4159414 (1979-06-01), Suh et al.
patent: 4258078 (1981-03-01), Celler et al.
patent: 4273859 (1981-06-01), Mones
patent: 4403410 (1983-09-01), Robinson
patent: 4496607 (1985-01-01), Mathias
patent: 4682414 (1987-07-01), Butt
patent: 4710253 (1987-12-01), Soszek
patent: 4722470 (1988-02-01), Johary
patent: 4802276 (1989-02-01), Bowcutt
patent: 4976808 (1990-12-01), Ogasawara
patent: 4981715 (1991-01-01), Hirsch
Serial No. 07/422,939.
Serial No. 07/494,897.
Miller, Jr., "Lasers as Reflow Soldering Tools", Hybrid Circuit Technology, Jul. 1988, pp. 27-31.
Soszek, "Circuit-Deposition Techniques For PCBs", Advanced Materials & Processes, Apr. 1989, pp. 33-38.
"New Methods Produce Fine Metal Particles for Conductive Links", Electronic Packaging and Production, Mar. 1990, p. 15.
"Hot-Atom Chemistry Shrinks Conductive Ink", Electronic Design, Mar. 2, 1990, p. 21.
"Printron Process Overview", News Release by Printron, Inc. of Albuquerque, N.M., Mar. 1990.
Hirsch et al., "Selective-Area Electroless Copper Plating on Polyimide Employing Laser Patterning on Catalytic Film", Applied Physics Letters, vol. 57 (13), Sep. 24, 1990, pp. 1357-1359.

Affiliated with

Also associated with

Rating

Method of patterned metal reflow on interconnect substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of patterned metal reflow on interconnect substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of patterned metal reflow on interconnect substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-931877