Method of paste printing using stencil and masking layer

Details Method of paste printing using stencil and masking layer Method of paste printing using stencil and masking layer

1999-06-17

2000-04-11

Hilten, John S.

Printing

Stenciling

Processes

10112821, 2282481, 228254, B41M 112

Patent

active

060476370

ABSTRACT:
A method for depositing a solder paste or other conductive or non-conductive material on a contact pad or other designated region of a substrate. A layer of resist is applied over the boundary of a region in which a bump of a deposited material is to be formed. The resist layer is applied by a screen printing process in which the portion of the screen overlying the region is blocked so that no resist is deposited where the bump is to be formed. The screen is open in the areas surrounding the blocked portion, permitting resist to be deposited over any non-planar surfaces surrounding the intended bump location. This provides a substantially planar surface which may be used as a mask for direct paste deposition into the region where the bump is to be formed, or the planar surface may be used as a flat surface upon which a stencil may be supported. After formation of the bump of conductive or non-conductive paste, the sacrificial resist layer is removed.

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