Method of passivating a semiconductor device by treatment with a

Metal treatment – Compositions – Heat treating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148187, 357 13, 357 91, H01L 2126, H01L 21265

Patent

active

041135148

ABSTRACT:
A method of passivating a semiconductor device having at least one active component disposed therein comprises exposing the device to atomic hydrogen at a temperature lower than about 450.degree. C.

REFERENCES:
patent: 3390011 (1968-06-01), Brown et al.
patent: 3859127 (1975-01-01), Lehner
patent: 3943014 (1976-03-01), Yoshizawa
patent: 4013485 (1977-03-01), Ma et al.
patent: 4056408 (1977-11-01), Bartko et al.
Appelbaum et al., "Hydrogen Chemisorption on Si . . .", Phys. Rev. Letts. 39, (1977), 1487.
Pankove et al., "Photoluminescence of Hydrogenated . . . Si", Appl. Phys. Letts. 31, (1977), 450.
Sakurai et al., "Hydrogen Chemisorption on . . . Si . . .", J. Vac. Sci. Techn. 13, (1976), 807.
Gorelkinskii et al., "Epr . . . in Si by H.sup.+ Implantation", Phys. Stat. Solid; k55, vol. 22(a), 1974.
Brodsky, "Making Higher Efficiency Solar Cells. . .", IBM - TDB, 18, (1975), 582.
Stein, "Bonding and . . . Implanted H in Si", J. Electron. Mat. 4, (1975), 159.
Ibach et al., "Hydrogen Adsorption . . . of Si", Surf. Science, 43 (1974), 481.
Ohmura et al., "Shallow Donor . . . in Si . . . by H.sup.+ . . .", Phys. Stat. Solid, 15a, (1973), 93.
Ohmura et al., "Electrical Properties of n-type Si . . .", Solid St. Comm. 11, (1972), 263.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of passivating a semiconductor device by treatment with a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of passivating a semiconductor device by treatment with a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of passivating a semiconductor device by treatment with a will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2382542

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.