Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2005-08-23
2005-08-23
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S614000, C438S692000, C438S781000
Reexamination Certificate
active
06933179
ABSTRACT:
When a wafer, which has completed a wafer process and has a main surface on which a plurality of bumps respectively connected to a plurality of electrode pads are formed, is brought into a resin molded type package to thereby manufacture a semiconductor device, a method of manufacturing such a semiconductor device includes placing a sheet encapsulating material containing a thermosetting resin over the wafer so as to cover the main surface of the wafer and, heating and curing the sheet encapsulating material by a heating apparatus to thereby form an encapsulating resin layer.
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Fourson George
Oki Electric Industry Co. Ltd.
Rabun & Berdo, PC
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