Method of packaging semiconductor device

Details Method of packaging semiconductor device Method of packaging semiconductor device

1989-06-09

1990-07-17

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 29841, 357 72, 174 522, 26427211, H01L 2160, H01L 21603, H01L 2156

Patent

active

049421409

ABSTRACT:
In a method of packaging a semiconductor device, the semiconductor device and a mounting body are positioned in such a manner that electrodes of the semiconductor device and leads of the mounting body are brought into slidable mechanical contact with each other, the electrodes being not bonded to the leads. Next, an insulating resin that shrinks on setting is supplied in such a manner that the contacted portions of the electrodes and the leads are covered. Subsequently, the resin is set while keeping the electrodes and the leads in contact with each other to bond the electrodes to the leads whereby the resin, when set, applies a compressive force between the electrodes and the leads.

REFERENCES:
patent: 3838984 (1974-10-01), Crane et al.
Kamei et al., "Hybrid Structures Using Solder Reflow Technology", IEEE Transactions on components . . . , 1979, pp. 208-217.
Hoffman, "TAB Implementation and Trends", Solid State Technology, Jun. 1988, pp. 85-88.

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