Method of packaging RF MEMS

Details Method of packaging RF MEMS Method of packaging RF MEMS

2006-05-23

2006-05-23

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S458000, C438S459000, C438S460000

Reexamination Certificate

active

07049175

ABSTRACT:
A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, for example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.

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