Method of packaging microwave semiconductor components and integ

Details Method of packaging microwave semiconductor components and integ Method of packaging microwave semiconductor components and integ

1990-10-04

1991-11-05

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437214, 437215, 437219, 437974, 437180, 357 72, 357 74, 357 80, 357 81, H01L 2160

Patent

active

050631772

ABSTRACT:
Integration and packaging of monolithic microwave integrated circuits (MMIC) components is facilitated by using a motherboard comprising high resistivity silicon, which having a thermal conductivity three times that of gallium arsenide. Ultra high purity, uncompensated silicon preferably is used. Anisotropic etching of recesses in the motherboard facilitates precise placement of the MMICs in the recesses, enabling use of automated die and wire bonding techniques to reduce required assembly time substantially. Using a silicon motherboard also ultimately enables incorporation of required control circuitry. The silicon motherboard also transmits RF energy well, a useful characteristic particularly in C-band and X-band applications in which microstrip is used, though other transmission media function well at even higher frequencies.

REFERENCES:
patent: 4026759 (1977-05-01), McBride et al.
patent: 4030943 (1977-06-01), Lee et al.
patent: 4199777 (1980-04-01), Maruyama et al.
patent: 4442590 (1984-04-01), Stockton et al.
patent: 4465549 (1984-08-01), Ritzman
patent: 4483067 (1984-11-01), Parmentier
patent: 4684965 (1987-08-01), Tajima et al.
patent: 4706374 (1987-11-01), Murakami
patent: 4784970 (1988-11-01), Solomon
patent: 4789645 (1988-12-01), Calviello et al.
patent: 4794093 (1988-12-01), Tone et al.
patent: 4807022 (1989-02-01), Kazior et al.
patent: 4859629 (1989-08-01), Reardon et al.
patent: 4956697 (1990-09-01), Kobiki et al.
patent: 5006487 (1991-04-01), Stokes

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