Method of packaging electronic parts

Details Method of packaging electronic parts Method of packaging electronic parts

2007-04-10

2007-04-10

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S025350, C029S415000, C029S834000, C029S835000, C257S459000, C257S798000, C438S108000, C438S113000, C438S118000

Reexamination Certificate

active

10777135

ABSTRACT:
A method of fabricating electronic parts includes the steps of: mounting electronic elements in regular cavities that are two-dimensionally arranged on a baseboard on which dummy cavities are provided so as to surround the regular cavities, and covering a top of the baseboard with a resin sheet.

REFERENCES:
patent: 5991989 (1999-11-01), Onishi et al.
patent: 6268236 (2001-07-01), Miyawaki
patent: 6310421 (2001-10-01), Morishima
patent: 6698084 (2004-03-01), Uchikoba
patent: 6923958 (2005-08-01), Xiang et al.
patent: 2001-53577 (2001-02-01), None
patent: 2001-110946 (2001-04-01), None

Affiliated with

Also associated with

Rating

Method of packaging electronic parts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of packaging electronic parts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of packaging electronic parts will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3776323