Method of packaging electronic components

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29574, 29576S, 29588, 29627, 264251, 264272, H01L 2166

Patent

active

041020391

ABSTRACT:
A carrier structure for electronic components which allows safe handling, testing, marking and shipment is fabricated as an integral part of the electronic component package. The carrier forms a square protective enclosure surrounding the electronic device and connected to the electronic device by breakable plastic tabs which are molded with the electronics component package. The structure allows the electrical leads of the electronic component to be trimmed, formed, and tested while the component is still attached to the carrier.

REFERENCES:
patent: 3606673 (1971-09-01), Overman
patent: 4012766 (1977-03-01), Phillips et al.
patent: 4026008 (1977-05-01), Drees et al.

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