Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-04-29
1999-04-27
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29740, 29834, H05K 330
Patent
active
058966528
ABSTRACT:
The present invention provides a method of packaging an electronic component, which permits improvement of mounting accuracy of various components against non-uniform deformation of the printed circuit board, and simplification of the correcting operation. The method of the present invention comprises the steps of dividing the printed circuit board c to be placed on the packaging section m into a plurality of prescribed areas c1 . . . , determining a reference origin a1 . . . for mounting the electronic component for each of the plurality of areas, setting the resultant coordinates in the control means 1, measuring a reference origin for each of the plurality of areas by means of detecting means prior to packaging, calculating and setting a correction origin for each area through the control means 1 on the basis of this measurement, controlling the mounting head 2 individually for each area, and mounting the prescribed electronic component.
REFERENCES:
patent: 4348276 (1982-09-01), Tateishi et al.
patent: 4738025 (1988-04-01), Arnold
patent: 4809430 (1989-03-01), Maruyama et al.
patent: 4979290 (1990-12-01), Chiba
patent: 5003692 (1991-04-01), Izumi et al.
patent: 5048178 (1991-09-01), Bindra et al.
patent: 5079834 (1992-01-01), Itagaki et al.
patent: 5379514 (1995-01-01), Okuda et al.
patent: 5384956 (1995-01-01), Sakarai et al.
patent: 5456003 (1995-10-01), Yamamoto et al.
patent: 5457880 (1995-10-01), McKinley et al.
patent: 5501005 (1996-03-01), Onitsuka
patent: 5649356 (1997-07-01), Gieskes
patent: 5787577 (1998-08-01), Kent
Tagata Genichi
Uchida Tomohide
Arbes Carl J.
Tenryu Technics Co., Ltd.
LandOfFree
Method of packaging electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of packaging electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of packaging electronic components will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-676377