Method of packaging electronic component parts using a eutectic

Details Method of packaging electronic component parts using a eutectic Method of packaging electronic component parts using a eutectic

1989-10-05

1991-01-15

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228103, 2281802, 228105, 29833, 29840, H01L 2158

Patent

active

049847317

ABSTRACT:
The inventive method for packaging electronic component parts on a substrate by eutectic bonding after the substrate has been heated to exceed the eutectic temperature is designed to observe the thermal expansion of the substrate with a camera and moves the substrate stage in accordance with the observation result so as to modify the mount coordinates of the component part, thereby compensating the displacement of component parts caused by the substrate thermal expansion.

REFERENCES:
patent: 4586247 (1986-05-01), Murai et al.
patent: 4896418 (1990-01-01), Yearsley
patent: 4899921 (1990-03-01), Bendat et al.
patent: 4927068 (1990-05-01), Naka et al.

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