Method of packaging an integrated circuit in an inert gas

Details Method of packaging an integrated circuit in an inert gas Method of packaging an integrated circuit in an inert gas

1989-05-10

1991-08-06

Culver, Horace M.

Package making

Methods

With contents treating

53478, B65B 3102, B65B 2500

Patent

active

050366467

ABSTRACT:
The present invention relates to a container for an integrated circuit wafer comprising a tray-shaped member having a recess and a complimentary sheet member sized to attach to and cover said recess, at least one of said members being made from a material selected from the group consisting of a single layer of a high nitrile resin, and a laminated layer of a high nitrile resin, a polyvinylidene chloride resin, an ethylene vinyl alcohol copolymer or a polyvinyl alcohol resin, and a method for storing the wafer.

REFERENCES:
patent: D248215 (1978-06-01), Cherry
patent: 3756399 (1973-09-01), Cosier et al.
patent: 3783089 (1974-01-01), Hurst et al.
patent: 3910410 (1975-10-01), Shaw
patent: 4063349 (1977-12-01), Passler et al.
patent: 4409252 (1983-10-01), Buschkens et al.
patent: 4693056 (1987-09-01), Raszewski
patent: 4867336 (1989-09-01), Stewart

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