Method of packaging a semiconductor light emitting device

Details Method of packaging a semiconductor light emitting device Method of packaging a semiconductor light emitting device

2006-08-08

2006-08-08

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

C438S117000, C438S124000, C438S126000, C438S127000

Reexamination Certificate

active

07087465

ABSTRACT:
A semiconductor light emitting device is packaged by forming a sealed compartment enclosing the device, at least one of the walls of the sealed compartment being formed of an elastomeric material. The elastomeric material is then penetrated with a needle and a quantity of softer material is injected through the needle into the sealed compartment. In some embodiments, a coaxial needle or two needles are used, one needle to inject the softer material and one needle to vent air from the compartment.

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