Method of packaging a semiconductor laser and photosensitive sem

Details Method of packaging a semiconductor laser and photosensitive sem Method of packaging a semiconductor laser and photosensitive sem

1988-03-30

1989-10-31

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437220, 437206, 437 2, 206330, 357 19, 29833, H01L 2156

Patent

active

048777560

ABSTRACT:
A method of constructing a semiconductor laser includes producing a lead frame having a central lead which is used as a die pad at its central portion and two outside leads connected to the central lead by tie bars, mounting a semiconductor laser chip and a light receiving chip on the central lead of the lead frame, connecting the semiconductor laser chip and the light receiving chip to respective outside leads with wires, sealing portions of the leads, the wires, and both chips in a transparent package, and cutting the tie bars to disconnect the outside leads from the central lead.

REFERENCES:
patent: 3264712 (1963-05-01), Teruo Hayashi et al.
patent: 3611061 (1971-10-01), Segerson
patent: 4160308 (1979-07-01), Courtney et al.
patent: 4641418 (1987-02-01), Meddles

Affiliated with

Also associated with

Rating

Method of packaging a semiconductor laser and photosensitive sem does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of packaging a semiconductor laser and photosensitive sem, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of packaging a semiconductor laser and photosensitive sem will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-625973