Method of packaging a semiconductor device

Details Method of packaging a semiconductor device Method of packaging a semiconductor device

1996-08-19

1997-08-12

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

26427217, 438126, H01L 2160

Patent

active

056565496

ABSTRACT:
A method of packaging a semiconductor device includes providing a chase (11) with a cavity (12). The cavity (12) has a cavity sidewall (13). A substrate (19) is provided having a substrate sidewall (20) wherein the substrate (19) is positioned in the cavity (12). A space or gap (21) is formed between the substrate sidewall (20) and the cavity sidewall (13). To insulate the gap (21) from mold compound (27), a barrier layer (22) is placed adjacent to the chase (11) and adjacent to the substrate (19) wherein the barrier layer (22) overlays a portion of the space or gap (21). Mold compound (27) is injected over the barrier layer (22), over the portion of the space or gap (21), and toward the substrate (19). The barrier layer (22) is used to prohibit the mold compound (27) from contacting the substrate sidewall (20) and the cavity sidewall (13) when the substrate (19) is being encapsulated.

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patent: 5527743 (1996-06-01), Variot
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