Method of packaging a power semiconductor device

Details Method of packaging a power semiconductor device Method of packaging a power semiconductor device

1994-07-06

1995-09-05

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 525, 235488, 437209, 437217, H01R 4300

Patent

active

054469597

ABSTRACT:
A method of packaging a power semiconductor device is disclosed, comprising the steps of preparing a lead frame including a paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus the method can be applied to produce a plastic package of a power semiconductor device at low cost. The metal cap is grounded through the tie bars as a source electrode to shield a noise.

REFERENCES:
patent: 4079511 (1978-03-01), Grabbe
patent: 4493143 (1985-01-01), Maier
patent: 4783428 (1988-11-01), Kalfus
patent: 4829403 (1989-05-01), Harding
patent: 4855868 (1989-08-01), Harding
patent: 5270262 (1993-12-01), Switky et al.
patent: 5298684 (1994-03-01), Leeb
patent: 5362680 (1994-11-01), Heinen et al.

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