Method of packaging a non-contact I/O signal transmission integr

Details Method of packaging a non-contact I/O signal transmission integr Method of packaging a non-contact I/O signal transmission integr

1988-01-13

1989-07-04

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 2, 437 5, 437 23, 437127, 437984, 148DIG99, 350 962, 350 9615, 350 9624, 358901, H01L 2302

Patent

active

048450529

ABSTRACT:
The I/O ports of a packaged IC includes a plurality of optical conduits in the package adjacent electro-optical transmitters and receivers throughout the die spaced from the periphery of the die. The method of assembling the die in the package includes using optical transmitters on the die to align the top of the package and the optical conduits to the die which was previously mounted in the base of the package.

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