Method of packaging a field emission display

Details Method of packaging a field emission display Method of packaging a field emission display

1998-11-25

2001-07-17

Patel, Vip (Department: 2879)

Electric lamp or space discharge component or device manufacturi

Process

With assembly or disassembly

Reexamination Certificate

active

06261145

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method of manufacturing a field emission display, and more particularly to a method of packaging a field emission display.
2. Description of the Prior Art
A principle of a field emission device is as follows. Voltage is applied to a gate and an emitter tip so that electrons are emitted from the emitter tip. The electrons are accelerated by anode voltage and collided to an anode on which luminescent material is deposited. The luminescent material is excited by the electrons and emits light.
FIG. 1A
is a cross sectional view for explaining a conventional field emission device. As shown in
FIG. 1A
, the field emission device has a lower substrate
100
on which an emitter tip
101
and a gate
102
are formed, and an upper substrate
120
under which anodes having luminescent materials are formed, with the lower and upper substrates
110
and
120
are combined by a spacer
130
. The field emission device must be maintained in vacuum state.
FIGS. 2A
to
2
C are cross sectional views for explaining a conventional method of packaging a field emission display.
Referring to
FIG. 2A
, a lower substrate
110
on which a field emission device
100
is formed, and an upper substrate
120
having transparent electrodes
122
, on which luminescent materials
121
are deposited, respectively, are combined by spacer
130
such as frit glass. An opening is formed in the lower substrate
110
and a glass tube
140
is attached to the lower substrate so that the opening is correspond to the glass tube
140
. An exhaust process is performed to be exhaust air between the upper and lower substrates
120
and
110
through the tube
140
, thereby maintaining vacuum degree of 1×10
−7
Torr.
FIG. 2B
is a cross sectional view to show a seal-off process. The lower part of the glass tube
140
is melted by a heater
150
. If the glass tube melts some, the melt part of the glass tube
140
shrinks and is sealed off because of pressure difference by vacuum.
FIG. 2C
is a cross sectional view in which the rest part of the glass tube
140
is cutted off.
However, vapor from the glass tube
140
is generated instantaneously and degrades internal vacuum at the very moment that the glass tube
140
melts in the vacuum packaging process as described above. Also, it is difficult to manufacture a field emission display with a flat board because of the long projected glass tube
140
.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide a flat field emission display of high vacuum which can solve the above problems.
To achieve the above object, a method of packaging a field emission display, comprising the steps of: forming an opening on a selected area of a lower substrate on which field emission elements are formed and forming a silicon layer on a lower surface of the lower substrate; positioning a lateral wall between an upper substrate having a transparent electrode and luminescent material formed on a lower surface thereof and the lower substrate, and combining the upper substrate, the lateral wall and the lower substrate; placing a cap on the opening after performing a vacuum process through the opening; performing a thermal treatment process to create silicide by a reaction of the cup and the silicon layer, thereby the opening is sealed by the silicide; and completely sealing the opening by using adhesives.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.


REFERENCES:
patent: 5788551 (1998-08-01), Dynka et al.
patent: 5807154 (1998-09-01), Watkins
patent: 5827102 (1998-10-01), Watkins et al.
patent: 5980349 (1999-11-01), Hofmann et al.
patent: 6007397 (1999-12-01), Ju et al.
B.K. Ju et al., “Glass-to-Glass Wafer Anodic Bonding and Its Application to FEA/FED Micro-packaging”, Asia Display 98, pp. 145-148. No date.
Kyung Sun Ryu et al., “Activation Effect of a Glass Packaged FED with Getter”, Asia Display 98, pp. 689-692. No date.

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