Method of optimizing the joints between layers in modelling...

Details Method of optimizing the joints between layers in modelling... Method of optimizing the joints between layers in modelling...

2003-02-06

2010-06-08

Shechtman, Sean P (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S182000, C264S510000

Reexamination Certificate

active

07734367

ABSTRACT:
In a method for optimizing the joints between layers along portions of the layers which are flush with the surface of a part obtained by computer-aided modeling or prototyping involving layer decomposition, the connecting profile of two successive layers is mathematically and numerically defined using an algorithm in which the surface of the joint at the end zone adjacent to the flush portions is always substantially normal to the plane tangential to the surface of the part along the flush portions.

REFERENCES:
patent: 2428658 (1947-10-01), Falk et al.
patent: 2477060 (1949-07-01), Hudak
patent: 2479191 (1949-08-01), Williams et al.
patent: 2615111 (1952-10-01), Paquette et al.
patent: 3039146 (1962-06-01), Engel
patent: 3369272 (1968-02-01), Martin, Jr. et al.
patent: 3612387 (1971-10-01), Rathbun
patent: 3790152 (1974-02-01), Parsons
patent: 3909582 (1975-09-01), Bowen
patent: 3932923 (1976-01-01), DiMatteo
patent: 4001069 (1977-01-01), DiMatteo
patent: 4250727 (1981-02-01), Baril et al.
patent: 4338068 (1982-07-01), Suh et al.
patent: 4586690 (1986-05-01), Härtel et al.
patent: 4601652 (1986-07-01), Ando et al.
patent: 4675825 (1987-06-01), DeMenthon
patent: 4752352 (1988-06-01), Feygin
patent: 4778557 (1988-10-01), Schirmer
patent: 4781555 (1988-11-01), Cook
patent: 5015312 (1991-05-01), Kinzie
patent: 5031483 (1991-07-01), Weaver
patent: 5354414 (1994-10-01), Feygin
patent: 5514232 (1996-05-01), Burns
patent: 5663883 (1997-09-01), Thomas et al.
patent: 5725891 (1998-03-01), Reid, Jr.
patent: 5765137 (1998-06-01), Lee
patent: 5775402 (1998-07-01), Sachs et al.
patent: 5776409 (1998-07-01), Almquist et al.
patent: 5793015 (1998-08-01), Walczyk
patent: 5812402 (1998-09-01), Makiuchi et al.
patent: 5847958 (1998-12-01), Shaikh et al.
patent: 5943240 (1999-08-01), Nakamura
patent: 6021358 (2000-02-01), Sachs
patent: 6110409 (2000-08-01), Allanic et al.
patent: 6136132 (2000-10-01), Kinzie
patent: 6164115 (2000-12-01), Higuchi et al.
patent: 6276656 (2001-08-01), Baresich
patent: 6284182 (2001-09-01), McNally
patent: 6324438 (2001-11-01), Cormier et al.
patent: 6344160 (2002-02-01), Holtzberg
patent: 6358029 (2002-03-01), Niimi
patent: 6405095 (2002-06-01), Jang et al.
patent: 6409902 (2002-06-01), Yang et al.
patent: 6454924 (2002-09-01), Jedrzejewski et al.
patent: 6544024 (2003-04-01), Yim
patent: 6554882 (2003-04-01), Zhou et al.
patent: 6617601 (2003-09-01), Wiklund
patent: 6627030 (2003-09-01), Yang et al.
patent: 6627835 (2003-09-01), Chung et al.
patent: 6688871 (2004-02-01), Lee et al.
patent: 6719554 (2004-04-01), Hobson
patent: 6728591 (2004-04-01), Hussey et al.
patent: 6745446 (2004-06-01), Barlier
patent: 6756309 (2004-06-01), Chen et al.
patent: 6921068 (2005-07-01), Barlier et al.
patent: 6991021 (2006-01-01), Ramirez et al.
patent: 7003864 (2006-02-01), Dirscherl
patent: 2002/0125613 (2002-09-01), Cominsky
patent: 2002/0149137 (2002-10-01), Jang et al.
patent: 2002/0162940 (2002-11-01), Frul et al.
patent: 2002/0165634 (2002-11-01), Skszek
patent: 2003/0006001 (2003-01-01), Yang et al.
patent: 2003/0122277 (2003-07-01), Padovani
patent: 2003/0141609 (2003-07-01), Jia
patent: 2004/0173930 (2004-09-01), Himmer et al.
patent: 2004/0173951 (2004-09-01), Hobson
patent: 2004/0217497 (2004-11-01), Engwall et al.
patent: 3711470 (1988-10-01), None
patent: 4041105 (1992-06-01), None
patent: 0585502 (1994-03-01), None
patent: 0606627 (1994-07-01), None
patent: 0655317 (1995-05-01), None
patent: 0655668 (1995-05-01), None
patent: 0738583 (1996-10-01), None
patent: 0763417 (1997-03-01), None
patent: 0811457 (1997-12-01), None
patent: 0620946 (1999-06-01), None
patent: 2233137 (1975-01-01), None
patent: 2625135 (1989-06-01), None
patent: 2673302 (1992-08-01), None
patent: 2750064 (1997-12-01), None
patent: 2789187 (2000-08-01), None
patent: 2789188 (2000-08-01), None
patent: 2808896 (2001-11-01), None
patent: 2809040 (2001-11-01), None
patent: 2834803 (2003-07-01), None
patent: 2834803 (2004-02-01), None
patent: 2845492 (2004-04-01), None
patent: 2011814 (1979-07-01), None
patent: WO/9112120 (1991-08-01), None
patent: WO/9508416 (1995-03-01), None
patent: WO/9900234 (1999-01-01), None
patent: WO 9911832 (1999-03-01), None
patent: WO/0222341 (2002-03-01), None
Bocking et al., “Electrochemical Routes for Engineering Tool Production”, The GEC Journal of Technology, vol. 14, No. 2, pp. 66 to 74 (1997).
T. Himmer, et al., “Lamination of Metal Sheets”, Computers in Industry, Elsevier Science Publishers, Amsterdam, Netherlands, vol. 39, No. 1, pp. 27-33 (Jun. 1999).
Patent Abstracts of Japan, vol. 016, No. 370 (M-1292) Published: Aug. 10, 1992 (pertaining to JP 04 118221 (Fujitsu Ltd.), published Apr. 20, 1992).
Patent Abstracts of Japan, vol. 1995, No. 11 Published: Dec. 26, 1995 (pertaining to JP 07 214274 (U Mold:KK), published Aug. 15, 1995).
T. Polito, “Comment Optimiser le Moulage des Plastiques”, (“How to Optimize the Molding of Plastics”), Emballages Magazine, Jan.-Feb. 2002, Supplement No. 605, pp. 56 and 57.
Choi et al, “Design and Evaluation of a Laser-Cutting Robot for Laminated, Solid Freeform Fabrication”, Proceedings of the 2000 IEEE International Conference on Robotics & Automation, San Francisco, CA (Apr. 2000).

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