Method of optically inspecting multi-layered electronic parts an

Details Method of optically inspecting multi-layered electronic parts an Method of optically inspecting multi-layered electronic parts an

1997-06-23

2000-01-11

Evans, F. L.

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

G01N 2188

Patent

active

06014209&

ABSTRACT:
A novel optical inspection technique for multi-layer wafers and the like in which conductor patterns of a top layer only are to be inspected, such layer being upon an intermediate transparent or translucent insulation layer in turn upon a base layer(s) thereunder, wherein the intermediate layer only is fluoresced, displaying the top layer conductors as dark in the field of fluorescent light, and causing reflections from layers below the intermediate layer effectively to disappear to obviate confusion with the top layer conductors to be inspected.

REFERENCES:
patent: 5053626 (1991-10-01), Tillotson
patent: 5278012 (1994-01-01), Yamanaka et al.
patent: 5324401 (1994-06-01), Yeung et al.
patent: 5455998 (1995-10-01), Miyazono et al.

Affiliated with

Also associated with

Rating

Method of optically inspecting multi-layered electronic parts an does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of optically inspecting multi-layered electronic parts an, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of optically inspecting multi-layered electronic parts an will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1466455