Method of operating a molding machine with release film

Details Method of operating a molding machine with release film Method of operating a molding machine with release film

1995-11-21

1999-04-06

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Direct application of fluid pressure differential to...

Producing multilayer work or article

26427214, 26427217, 264276, 425544, 425546, 425116, B29C 3318, B29C 3368, B29C 4502

Patent

active

058913840

ABSTRACT:
An object of the present invention is to provide a resin molding machine having molding dies, which have simple structures and which can be easily made. Another object is to provide a method of resin molding using release film, which is capable of employing various materials as a material for the molding dies. In the resin molding machine of the present invention, molding dies have molding sections including cavities, and the molding dies are capable of clamping a member to be molded. A pot pressurizes and sends resin melt to the cavities. A fixing mechanism fixes release film, which is capable of easily peeling off from the molding dies and resin for molding, on inner faces of the molding sections and clamping faces, and the fixing mechanism fixes the release film by sucking air.

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Semiconductor Packaging Update, "The 3P Process: Reengineering the Semiconductor Packaging/Assembly Workplace", pp. 2-12, 1994, vol. 9, No. 6, Editor & Publisher: Dr. Subash Khadpe.

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