Method of obtaining surface mount component planarity

Details Method of obtaining surface mount component planarity Method of obtaining surface mount component planarity

1986-12-08

1988-08-09

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

228255, 29843, H05K 334

Patent

active

047618809

ABSTRACT:
A packaging technique for finely leaded electronic devices for attachment by surface methods to printed circuit boards is disclosed wherein the leads are imbedded in solder foil prior to the completion of lead forming operations so as to maintain planarity of the leads and to prevent damage thereto during handling, placement and attachment processes.

REFERENCES:
patent: 3657789 (1972-04-01), Anglade
patent: 3913818 (1975-10-01), Osipov et al.
patent: 4505035 (1985-03-01), Burton et al.

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