Method of nickel-gold plating and printed circuit board

Details Method of nickel-gold plating and printed circuit board Method of nickel-gold plating and printed circuit board

2011-07-19

2011-07-19

Mayo, III, William H (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C428S209000

Reexamination Certificate

active

07982138

ABSTRACT:
Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.

REFERENCES:
patent: 4842961 (1989-06-01), Basile et al.
patent: 5780143 (1998-07-01), Shimamoto et al.
patent: 7078796 (2006-07-01), Dunn et al.
patent: 2005/0141836 (2005-06-01), Peret
patent: 2007/0104929 (2007-05-01), Yim et al.
patent: 2007/0243665 (2007-10-01), Abbott et al.
patent: 2009/0218119 (2009-09-01), Nakai et al.
patent: 2009/0218125 (2009-09-01), Nakai et al.
patent: 2009/0286104 (2009-11-01), Tysoe et al.
patent: 06-310830 (1994-11-01), None
patent: 07-007243 (1995-01-01), None
patent: 07007243 (1995-01-01), None
patent: 10-0648970 (2006-11-01), None
patent: 10-0756261 (2007-09-01), None
Machine Translation of JP 07007243 A: Okuda, Y., Electrolytic gold @ plating process for printed wiring.
Japanese Office Action, with partial English translation, issued in Japanese Patent Application No. 2009-017933, mailed Jan. 4, 2011.
Korean Office Action, w/ partial English translation thereof, issued in Korean Patent Application No. KR 10-2008-0087865 dated May 19, 2010.

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