Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-02-02
1994-10-04
Barry, Chester T.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1562731, 1562733, 1562739, 1562753, 437183, 427 96, 427 71, 427282, 427205, 427199, B32B 3100, B05D 512, H01L 2144
Patent
active
053523180
ABSTRACT:
Electrode terminals formed on a pair of a circuit substrate and another circuit substrate or electrical element are mutually connected electrically by the medium of electroconductive particles. Prior to the connection, the electroconductive particles may be charged and dispersed onto a circuit substrate to be selectively attached to the electrode terminals thereon. The selective attachment may be enhanced by masking a part other than the connecting part of the electrode terminals of the circuit substrate with an insulating member or film so as to guide the charged electroconductive particles along electric lines of force directed to the exposed parts of the electrode terminals. The attached electroconductive particles are sandwiched between the pair of circuit substrates, which may be secured to each other by an insulating adhesive or an electroconductive resin.
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M. Masuda, et al., "Chip on Glass Technology for Large Capacity and High Resolution LCD," Proceedings of the IEEE/CHMI 1989 International Electronic Manufacturing Technology Symposium, pp. 55-58 (Apr. 1989).
Takabayashi Hiroshi
Takahashi Masanori
Barry Chester T.
Canon Kabushiki Kaisha
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