Method of mounting thick film hybrid circuits in printed circuit

Details Method of mounting thick film hybrid circuits in printed circuit Method of mounting thick film hybrid circuits in printed circuit

1979-12-31

1981-10-13

Godici, Nicholas P.

Metal working

Method of mechanical manufacture

Electrical device making

29418, 29423, 228180R, 228212, H05K 336

Patent

active

042940079

ABSTRACT:
In this method of fabricating an electrical circuit assembly, a thick film hybrid substrate is held in an inverted position as apertured glass-ceramic beads are placed over the end leads on the substrate. A drop of liquid flux is then applied to the apertures to hold the beads in place. After the flux dries, the leads are inserted into plated-through holes in a circuit board, with the beads locating portions of the leads above the board. Following wave soldering of the board, the beads are fractured with a sharp instrument prior to a cleaning operation which removes bead parts from the soldered assembly. In this manner, the substrate is flexibly mounted in the board so that the substrate can be tilted without damaging it.

REFERENCES:
patent: 3012315 (1961-12-01), Stillwagon, Jr.
patent: 3604836 (1971-09-01), Pierpont
patent: 3766631 (1973-10-01), Scheitlin et al.
patent: 3790916 (1974-02-01), Keitel
patent: 3842479 (1974-10-01), Willey
patent: 4089042 (1978-05-01), Torburn
patent: 4127692 (1978-11-01), Boynton

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