Method of mounting solid electrolytic capacitor onto printed cir

Electricity: electrical systems and devices – Electrolytic systems or devices – Solid electrolytic capacitor

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361538, 3612754, H01G 900

Patent

active

057842485

ABSTRACT:
A method and assembly are provided for mounting a solid electrolytic capacitor onto a printed circuit board including an anode pad and a cathode pad. The capacitor includes a capacitor element which has an anode and a cathode electrically separated by a dielectric substance. The cathode includes an outer cathode terminal layer formed over the element. The method includes the steps of removing a part of the cathode terminal layer to expose a flat anode terminal surface, attaching the element to the printed circuit board for bringing the cathode terminal layer into electrical connection with the cathode pad, electrically connecting the flat anode terminal surface to the anode pad via a metal wire, and enclosing the element in a resin member for protection.

REFERENCES:
patent: 5446623 (1995-08-01), Kanetake
patent: 5459641 (1995-10-01), Kuriyama
patent: 5502614 (1996-03-01), Kuriyama
patent: 5504647 (1996-04-01), Kuriyama
patent: 5608602 (1997-03-01), Kuriyama
patent: 5638253 (1997-06-01), Hasegawa
patent: 5644281 (1997-07-01), Kuriyama
patent: 5661628 (1997-08-01), Yamagami

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