Method of mounting semiconductor lasers providing improved lasin

Details Method of mounting semiconductor lasers providing improved lasin Method of mounting semiconductor lasers providing improved lasin

1983-12-13

1989-05-23

Ramsey, Kenneth J.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

445 4, 437 8, 356399, H01S 302, B23K 100

Patent

active

048322512

ABSTRACT:
An improved method of mounting electroluminescent semiconductor laser devices onto heatsinks, wherein easy subsequent location of the lasing spot of the laser is provided, is disclosed. The method comprises placing a reference mark on the front of the heatsink, wetting solder to the heatsink and allowing it to harden, contacting the laser device to the hardened solder, applying current to the laser device to cause light emission, aligning the lasing spot to the reference mark and bonding the laser device to the heatsink while maintaining such alignment.

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patent: 4548466 (1985-10-01), Evans

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