Method of mounting semiconductor device

Details Method of mounting semiconductor device Method of mounting semiconductor device

1993-08-04

1995-07-11

Silbauch, Jan H.

Plastic and nonmetallic article shaping or treating: processes

Carbonizing to form article

Agglomeration or accretion

264156, 264261, 264263, 26427217, 264273, B29C 6548, B26F 131

Patent

active

054318637

ABSTRACT:
A method of mounting a semiconductor device including a film carrier having an insulating film having on one side thereof a connecting lead and a semiconductor element junctioned with the film carrier on an outer substrate, which includes forming an opening for adhesive forcing or adhesive injection in the insulating film within its bonding area to be in contact with a land part on the outer substrate and in an area near the bonding area, connecting the connecting lead to the land part on the outer substrate, and forcing or injecting an adhesive through the opening formed in the insulating film into the space between the film carrier and the outer substrate.

REFERENCES:
patent: 4017495 (1977-04-01), Jaffe et al.
patent: 4746392 (1988-05-01), Hoppe

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