Method of mounting semiconductor chips

Details Method of mounting semiconductor chips Method of mounting semiconductor chips

1974-10-31

1976-06-22

DiPalma, Victor A.

Metal working

Method of mechanical manufacture

Electrical device making

29576R, 357 17, H01L 2100

Patent

active

039641570

ABSTRACT:
Disclosed is a bonding and packaging scheme for semiconductor device chips with particular application to semiconductor monolithic display chips. The display chip is bonded face down in a recess formed in a transparent substrate. In one embodiment, the metallization on the chip is aligned and made coplanar with the auxiliary metallization on the substrate, and the gap between the metallizations is bridged by a conductive material. This can be accomplished, for example, by solder reflow or epoxy bonding techniques. In an alternative embodiment, the metallization is formed after the chip is bonded to the substrate utilizing a coating which fills the gap between the chip and the substrate. The substrate may be dyed to act as a contrast filter, and a magnifying lens may be molded thereon in further processing.

REFERENCES:
patent: 3325882 (1967-06-01), Chiou
patent: 3374537 (1968-03-01), Doelp
patent: 3484534 (1969-12-01), Kilby
patent: 3694902 (1972-10-01), Apgar
patent: 3745648 (1973-07-01), Wiesner
patent: 3816847 (1974-06-01), Nagao

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