Method of mounting semiconductor chip for producing semiconducto

Details Method of mounting semiconductor chip for producing semiconducto Method of mounting semiconductor chip for producing semiconducto

1981-07-08

1984-10-02

Gonzales, John

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29464, 29577R, 357 74, H05K 502

Patent

active

044750072

ABSTRACT:
A method for mounting a semiconductor chip to a supporting member in producing an integrated circuit, and a semiconductor chip supporting member used in this method, wherein the chip-mounting member having a chip-mounting surface with waved peripheral edge pattern is prepared, and a semiconductor chip is mounted onto this chip-mounting surface via a solder preform, and then the resulting assembly is subjected to a heat treatment to melt this solder. Whereupon, even when the semiconductor chip is placed at an eccentric position deviating from the central position of the mounting surface, it is pulled back toward substantially the required central position by virtue of the surface tension of the molten solder.

REFERENCES:
patent: 3392052 (1968-07-01), Davis
patent: 3869787 (1975-03-01), Umbaugh
patent: 4167413 (1979-09-01), Christ et al.

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