Method of mounting saw devices

Metal working – Piezoelectric device making

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Details

29840, 2281802, H05K 330

Patent

active

050350358

ABSTRACT:
A method of mounting a saw device comprising applying metallized areas to the surface of an appropriate substrate, attaching conductive leads to the metallized areas, locating the said surface adjacent a selected area of another substrate so that said leads contact conductive regions on the second substrate and attaching said leads to said conductive regions on the second substrate so that the first substrate is supported on the leads and the conductive regions.

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