Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit
Reexamination Certificate
2000-02-07
2002-07-02
Allen, Stephone (Department: 2878)
Radiant energy
Photocells; circuits and apparatus
Photocell controlled circuit
C250S216000, C250S201200, C250S239000
Reexamination Certificate
active
06414299
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method of mounting an optical sensor package in which an optical sensor package such as a charge coupled device (CCD) or the like used, for example as a distance measuring device for an automatic focusing device for a camera, can be accurately mounted on a mounting member.
2. Related Background Art
A current optical sensor has been used in various apparatuses. For example, a subject distance is measured with an optical sensor even in an autofocusing apparatus for a camera. After the optical sensor which is used therein is formed on a chip, it is generally sealed with resin or the like to be packaged.
FIG. 6
shows a structure of such optical sensor package
55
. As shown in
FIG. 6
, a chip
52
on which an optical sensor
51
is formed is wire-bonded to a lead frame
53
and the entire sensor package is sealed with resin
54
. Further, the mounting method for the optical sensor package has been variously proposed.
FIG. 5
is a general optical sensor package disclosed in Japanese Laid-Open Patent Application No. 8-62491. As shown in
FIG. 5
, an optical sensor package
45
shown in
FIG. 6
, which is soldered to be mounted on a flexible printed-circuit board (hereinafter referred to as FPC)
49
is held on a holding member
48
. That is, the resin
44
which seals the chip
42
is held on the holding member
48
and the holding member
48
is mounted on a base plate
46
. A position control of the optical sensor
41
is performed by providing a tool (not shown) on the holding member
48
and handling this tool.
However, in the mounting method for the optical sensor package shown in
FIG. 5
, the resin which seals the chip
42
of the optical sensor package
45
is held on the holding member
48
. Thus, there are the following disadvantages.
Since the optical sensor package
45
generally has a large error in the outer diameter, for example, the concave portion
48
a of the holding member
48
should be designed in large scale so that the error can be absorbed by the holding member
48
, resulting in a large holding member
48
.
Further, the large error in the outer diameter of the package
45
causes even a position shift of the optical sensor
41
with respect to an image formation lens
47
mounted on the base plate
46
. Accordingly, an amount of adjustment for the correction of the position shift must be increased and provision of a large space in a mounting portion for the optical sensor package
45
is needed. Therefore, a size of the whole package mounting portion is increased.
Further, this adjustment of the position shift is carried out by moving the holding member
48
holding the optical sensor package
45
. Thus, the tool force can also act on the optical sensor package
45
as an undesirable stress, and the accuracy of the adjustment can be deteriorated.
On the other hand, recently, an optical sensor package
65
shown in
FIG. 7
in which a part of a chip
62
, on which an optical sensor package
65
is formed, is three-dimensionally exposed has been also proposed. Such optical sensor package
65
is formed such that the sensor surface is directly bonded to one side of an FPC
63
and a protective glass member
64
is connected to the other side of the FPC
63
.
SUMMARY OF THE INVENTION
An object of the present invention is to solve the above-mentioned problems. Specifically, an object of the present invention is to provide a method of mounting an optical sensor package in which the optical sensor package can be accurately mounted on a mounting member.
Another object of the present invention is to provide a method of mounting an optical sensor package in which by using an optical sensor package having a chip on which an optical sensor was formed, a part of the chip being exposed, the exposed chip portion can be directly mounted on a mounting member.
Still another object of the present invention is to provide a method of mounting an optical sensor package in which the optical sensor package can be mounted by using an optical sensor package having a chip on which an optical sensor was formed, a part of the chip being exposed, forming a concave portion corresponding to the outer shape of the exposed chip portion in a mounting member, and fitting the exposed chip portion into the concave portion of the mounting member.
Still another object of the present invention is to provide a method of mounting an optical sensor package in which an exposed chip in the optical sensor package can be mounted on a mounting member through a holding member or a receiving member on the holding member.
REFERENCES:
patent: 4055761 (1977-10-01), Shimomura
patent: 5153429 (1992-10-01), Takahashi
patent: 5270534 (1993-12-01), Huiberts et al.
patent: 8-62491 (1996-03-01), None
Allen Stephone
Canon Kabushiki Kaisha
LandOfFree
Method of mounting optical sensor package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of mounting optical sensor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of mounting optical sensor package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2874869