Method of mounting LSI

Details Method of mounting LSI Method of mounting LSI

1987-01-22

1988-10-25

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 361403, 357 66, H05K 332

Patent

active

047793384

ABSTRACT:
A method of mounting an LSI or IC on a wiring circuit substrate by hot-pressing which comprises the steps of placing the pins of the LSI or IC on a heat sealant printed over the circuit pattern of the substrate, placing a film sheet on the entire or partial surface of the LSI chip or IC chip including the pins of the chip, and carrying out a hot-pressing operation on the film sheet.

REFERENCES:
patent: 4381602 (1983-05-01), McIver
patent: 4631820 (1986-12-01), Harada et al.

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