Method of mounting lead frame on substrate

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29840, H01R 4302

Patent

active

051367793

ABSTRACT:
A lead frame for orienting and then mounting a plurality of clip leads on a semi-conductor device or substrate and method.

REFERENCES:
patent: 4120558 (1978-10-01), Seidler
patent: 4214120 (1980-07-01), Jones, Jr. et al.
patent: 4257668 (1981-03-01), Ellis, Jr.
patent: 4357069 (1982-11-01), Milora
patent: 4367910 (1983-01-01), Seidler
patent: 4592617 (1986-06-01), Seidler
patent: 4766478 (1988-08-01), Dennis
patent: 4782589 (1988-11-01), Dennis
patent: 4816427 (1989-03-01), Dennis

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