Method of mounting integrated circuit chips on a substrate and a

Details Method of mounting integrated circuit chips on a substrate and a Method of mounting integrated circuit chips on a substrate and a

1977-05-31

1978-09-26

Smith, Al Lawrence

Metal fusion bonding

Process

With shaping

228 6A, 228 13, 228 565, 228180A, 228105, B23K 112, H01L 2160

Patent

active

041163761

ABSTRACT:
Method and apparatus to enable integrated circuit chips to be accurately mounted on substrates. Each chip is precisely positioned with respect to connecting areas on the substrates to which it is soldered. To this end, a support block is movable horizontally along a predetermined path and adapted to receive a substrate provided with at least one set of connecting areas arranged in a predetermined configuration about a center. A cutting tool having on the one hand a cutting head movable along a working axis perpendicular to the path followed by the support block is arranged to pass through a first fixed point on the said path, and on the other hand a cutting die arranged in the path of the head is arranged to receive an integrated circuit chip mounted on a support. A soldering tool is provided consisting of a soldering head movable along a working axis parallel to the working axis of the cutting tool and which passes through a second fixed point on the path followed by the support block, along with a positioning assembly whose positioning axis is parallel to the working axes and passes through a third fixed point on the path followed by the support block.
The substrate is shifted with respect to the support block to cause the center of a set of connecting areas to coincide with the said positioning axis, and the support block is locked in position under the cutting tool and then under the soldering tool in such a way that a reference on the said support block successively occupies, with respect to the respective working axis of the two tools, the same positions as occupied with respect to the positioning axis. Finally, actuating means are included to control the movements of the cutting and soldering heads.

REFERENCES:
patent: 3838984 (1974-10-01), Crane et al.
patent: 3887783 (1975-06-01), Comette
patent: 3946931 (1976-03-01), Bahnck et al.

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