Method of mounting electronics component

Details Method of mounting electronics component Method of mounting electronics component

1996-01-17

1998-04-28

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 22818021, H05K 334

Patent

active

057430071

ABSTRACT:
A method for mounting on integrated circuit having many leads with narrow pitches on the printed circuit board. In a method, a resist layer is formed between lands on the board, and solder paste is applied with a stencil to the lands so that the positions of the solder paste on the lands are staggered. Then, leads of the integrated circuit are positioned on the lands. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. In a different embodiment, each land includes a first portion and a second portion having a width narrower than the first portion, and the second portions are arranged staggeredly among the lands. Then, solder paste is applied to the first portions having the wider width. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. If solder including bismuth is used, reflow soldering can be performed in ambient environment.

REFERENCES:
patent: 4998342 (1991-03-01), Bonnell et al.
patent: 5320272 (1994-06-01), Melton et al.
patent: 5593080 (1997-01-01), Teshima et al.

Affiliated with

Also associated with

Rating

Method of mounting electronics component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of mounting electronics component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of mounting electronics component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1522806