Method of mounting electronic components

Details Method of mounting electronic components Method of mounting electronic components

2006-05-23

2006-05-23

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S833000, C029S902000, C029S836000

Reexamination Certificate

active

07047632

ABSTRACT:
An electronic component mounting apparatus removes an electronic component supplied to a part feeder in face-up status and mounts it to a board. A flip-chip supplied from a first holding table is removed and flipped over by a take-out head and then delivered to a mounting head, which mounts the component on the board. A die supplied from a second holding table is picked up directly and mounted to the board by the mounting head. This structure allows a single mounting apparatus to perform both die bonding and flip-chip bonding.

REFERENCES:
patent: 3465408 (1969-09-01), Clark et al.
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4515304 (1985-05-01), Berger
patent: 4761881 (1988-08-01), Bora et al.
patent: 4841633 (1989-06-01), Kinugawa
patent: 5839187 (1998-11-01), Sato et al.
patent: 5876556 (1999-03-01), Takanami
patent: 09-097805 (1997-04-01), None

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