Method of mounting electronic components

Details Method of mounting electronic components Method of mounting electronic components

1980-03-05

1982-01-26

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29831, 29832, 29834, 156327, 156330, 156332, 428901, B29C 2704

Patent

active

043126928

ABSTRACT:
A method of mounting electronic components on a printed circuit board by temporarily attaching the electronic component (4) to the circuit board (1) with adhesive (3) applied to the board (1), irradiating the adhesive (3) with ultraviolet rays with or without heating to cure the adhesive (3) and thereby rigidly attach the component (4) to the board (1), and thereafter joining the electrodes (5) of the component (4) to conductor portions (2) on the board (1). Excess adhesive portions (3a) adjoining the component (4) are cured first to subsequently cure the other portion of the adhesive (3) in chain relation to the curing of the excess.

REFERENCES:
patent: 2983853 (1961-05-01), Williams
patent: 4222635 (1980-09-01), Julke

Affiliated with

Also associated with

Rating

Method of mounting electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of mounting electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of mounting electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1665671