Method of mounting electronic components

Details Method of mounting electronic components Method of mounting electronic components

1989-06-20

1990-08-28

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29739, 29740, 29741, 29743, 29759, 156497, 156538, 156578, H05K 330, B32P 1900

Patent

active

049513885

ABSTRACT:
A method of mounting electronic components, comprising steps of: sucking an electronic component by a suction nozzle provided at the tip of a mounting head; holding the sucked electronic component in position by a centering device having an opening and closing mechanism and provided separately from the mounting head, and while holding the component applying adhesive to a side of the electronic component, the side being opposite to that sucked onto the suction nozzle; and mounting the electronic component to a designated position on a printed circuit board. The nozzles on the head are of different sizes.

REFERENCES:
patent: 4653664 (1987-03-01), Hineno et al.
patent: 4763405 (1988-08-01), Morita et al.

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