Method of mounting electronic components

Details Method of mounting electronic components Method of mounting electronic components

1980-02-13

1982-02-09

Husar, Francis S.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29834, 156155, 156291, 156292, 156578, 228175, B29C 1902

Patent

active

043148700

ABSTRACT:
In a method of mounting an electronic component wherein the electronic component is temporarily mounted on a printed circuit board before the component is securely mounted on the base plate by soldering, the improvement comprises steps of delivering adhesive to the front end of a coating head of an adhesive applicator, transferring the adhesive on to the printed circuit board between connection lands provided thereon for placement of the electronic component, and then positioning the electronic component on the adhesive applied to allow the electronic component to be held in position, with its bottom surface and a part of its side surface put in contact with the adhesive. The electronic component is thus mounted temporarily on the printed circuit board.

REFERENCES:
patent: 2983853 (1961-05-01), Williams
patent: 3294951 (1966-12-01), Olson
patent: 3666588 (1972-05-01), Wanesky
patent: 3704515 (1972-12-01), Nelson
patent: 3785903 (1974-01-01), Boyer et al.
patent: 3834966 (1974-09-01), Kelly
patent: 3933187 (1976-01-01), Marlinski
patent: 3966110 (1976-06-01), Boynton

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