Method of mounting electronic components

Details Method of mounting electronic components Method of mounting electronic components

1981-06-04

1983-08-16

Lawrence, Evan K.

Metal fusion bonding

Process

Plural diverse bonding

29840, 156332, 228180A, 525344, B23K 3102, C09J 314

Patent

active

043986609

ABSTRACT:
An improved method for mounting leadless electronic components on printed circuit boards so they can be soldered in place is disclosed. The method utilizes an acrylate adhesive composition which is rapidly cured in two stages by treatment with gaseous sulfur dioxide followed by heat.

REFERENCES:
patent: 4017652 (1977-04-01), Gruber
patent: 4020256 (1977-04-01), Zweigle et al.
patent: 4098977 (1978-07-01), Zweigle et al.
patent: 4107156 (1978-08-01), Sunamori et al.
patent: 4208005 (1980-06-01), Nate et al.
Ohsawa, UHIC System Makes Sophisticated Products Possible, Journal of Electrical Engineering, vol. 16, No. 150, pp. 50-53, Jun. 1979.

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