Method of mounting electronic component, structure for...

Details Method of mounting electronic component, structure for... Method of mounting electronic component, structure for...

2007-10-09

2007-10-09

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Preplacing solid filler

C228S122100, C228S123100

Reexamination Certificate

active

10839283

ABSTRACT:
The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that extends through the substrate, from connection electrodes formed on the lower surface of the substrate, to the upper surface of the substrate. A low melting point metal is connected to the connection electrodes and fills the through-hole. A bump and the low melting point metal are alloyed and bonded by heating the low melting point metal while pressing the bump formed on an electrode pad of an electronic component, with respect to a front end of the low melting point metal. The active surface of the electronic component is sealed by the upper surface of the substrate.

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