Method of mounting electrical and/or electronic components on a

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

29840, 29843, 174263, 2281801, 361417, 361419, H05K 702, H05K 334

Patent

active

049823760

ABSTRACT:
Hollow lead connection elements are placed in through holes in a one-side printed circuit board and are reflow soldered to the conductors with SMD devices on the conductor side of the board. Components are positioned on the conductor side with their leads passed through the connection elements. The leads are wave soldered to the elements on the side of the board opposite the conductors. The elements may have spring-loaded tongues for securing the leads thereto prior to soldering and a flange on the conductor side of the board.

REFERENCES:
patent: 2915678 (1959-12-01), Frazier et al.
patent: 3065524 (1962-11-01), Donnell et al.
patent: 3143787 (1964-08-01), Babbe
patent: 3159906 (1964-12-01), Telfer
patent: 3230612 (1966-01-01), Potter et al.
patent: 3528173 (1970-09-01), Gall
patent: 3867760 (1975-02-01), Horecky et al.
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4242719 (1980-12-01), Conley
patent: 4373259 (1983-02-01), Motsoh
patent: 4515304 (1985-05-01), Berger
patent: 4761881 (1988-08-01), Bora et al.
Technical Notes (RCA) Tn No.: 817, Mailed 1/12/1969, pp. 1-3 by E. Leshner.

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