Method of mounting electrical and/or electronic components of a

Details Method of mounting electrical and/or electronic components of a Method of mounting electrical and/or electronic components of a

1990-04-10

1992-09-01

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

361417, 361419, 174260, 439 83, 439 84, H05K 330, H05K 334

Patent

active

051445352

ABSTRACT:
A method of mounting SMD components (6, 7, 8) and wire components (21, 22) on a printed circuit board (2), in which the wire components (21, 22) ae secured on the printed circuit board (2) by means of connection elements (13, 14). The SMD components (6, 7, 8) and the connection elements (13, 14) are secured by reflow soldering on the printed circuit board (2), while the wire components (21, 22) are connected by their connection wires (19, 20) to the connection elements (13, 14) by welding.

REFERENCES:
patent: 3213325 (1962-10-01), Lindstrand
patent: 3485996 (1969-12-01), Chiou et al.
patent: 3586816 (1971-06-01), Hagen
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4242719 (1980-12-01), Conley
patent: 4515304 (1985-05-01), Berger
patent: 4631639 (1986-12-01), Biraud
patent: 4761881 (1988-08-01), Bora et al.

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