Metal working – Method of mechanical manufacture – Electrical device making
Patent
1982-05-28
1985-03-26
Rosenbaum, Mark
Metal working
Method of mechanical manufacture
Electrical device making
2281801, H05K 334
Patent
active
045064431
ABSTRACT:
A chip mounting substrate which comprises inserting holes formed in a substrate for inserting chips in, a sheet provided on the top surface of the substrate to cover the holes and having adhesivity on the inner surface covering the holes, and wiring pattern provided on the back surface of the substrate so as to be associated with electrode portions of the chips inserted in the inserting holes, so that after inserting the chips in the inserting holes to thereby temporarily adhere and fix them by the sheet, the electrode portion of each chip and the associated wiring pattern are soldered and connected together.
REFERENCES:
patent: 3966110 (1976-06-01), Boynton
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4215025 (1980-07-01), Packer et al.
patent: 4226659 (1980-10-01), Griffith et al.
patent: 4312692 (1982-01-01), Ikeda et al.
patent: 4314870 (1982-02-01), Ishida et al.
Arbes Carl J.
Clarion Co. Ltd.
Hattis Russell E.
Rosenbaum Mark
LandOfFree
Method of mounting electric part onto a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of mounting electric part onto a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of mounting electric part onto a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1287972