Method of mounting conductive ball and conductive ball...

Details Method of mounting conductive ball and conductive ball... Method of mounting conductive ball and conductive ball...

2008-08-08

2010-12-21

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S245000, C228S033000, C228S041000, C438S612000, C438S116000, C438S119000

Reexamination Certificate

active

07854366

ABSTRACT:
A method of mounting a conductive ball according to the present invention includes the steps of, disposing a mask on a substrate including connection pads, the mask having opening portions corresponding to the connection pad, supplying conductive balls on the mask, arranging the conductive balls on the connection pad of the substrate through the opening portions of the mask by moving the conductive balls to one end side of the mask by ball moving member (a brush), and removing excess conductive balls remaining on a region of the mask where the opening portions are provided, by bonding the excess conductive balls to a ball removal film (adhesive film).

REFERENCES:
patent: 6191022 (2001-02-01), Creswick
patent: 2003/0029908 (2003-02-01), Suzuki et al.
patent: 2007/0052112 (2007-03-01), Bauer et al.
patent: 2004-186286 (2004-07-01), None
patent: 2005-056901 (2005-03-01), None
patent: 2005-158944 (2005-06-01), None
patent: 2005158944 (2005-06-01), None
patent: 2006-173195 (2006-06-01), None
patent: 2007-507866 (2007-03-01), None
patent: WO 2007123384 (2007-11-01), None
JP2005158944 English translation.
Japanese Office Action dated Sep. 29, 2009.

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