Method of mounting and packaging elongate silicon devices on a c

Details Method of mounting and packaging elongate silicon devices on a c Method of mounting and packaging elongate silicon devices on a c

1981-11-27

1983-09-27

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29576S, 29589, 174 52FP, 357 80, H01L 2158

Patent

active

044060548

ABSTRACT:
Mounting silicon devices on a ceramic substrate creates considerable problems when the device has a geometry, such as being very long relative to its width, due to flatness and thermal mismatches. In the present invention a thin silicon substrate is interposed between base and device, the substrate of a geometry which reduces flatness and thermal mismatching to acceptable levels. Also the use of a silicon substrate enables well developed and easily provided silicon technology to form conductor patterns for interconnecting between device and base, avoiding problems of producing such conductor patterns on the ceramic base. The invention is particularly useful for the mounting of linear devices, such as linear imagers, which can have a length to width ratio in excess of 20:1.

REFERENCES:
patent: 3984620 (1976-10-01), Robillard et al.
Hnatek, E. R., User's Handbook of Integrated Circuits, John Wiley and Sons, New York, 1973, pp. 360-371, 407-420.

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