Method of mounting an LSI package

Details Method of mounting an LSI package Method of mounting an LSI package

1998-10-27

2000-03-07

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438106, 438118, H01L 2144, H01L 2148, H01L 2150

Patent

active

060339365

ABSTRACT:
To mount an LSI package to a wiring substrate, input/output pins for the LSI package are arranged on the wiring substrate beforehand. After solder has been fed to input/output pads formed on the package, the package is mounted to the wiring substrate by soldering the input/output and pins. The method allows the package to be easily removed from the wiring substrate if only the package is heated, and therby enhances repairability.

REFERENCES:
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 5378656 (1995-01-01), Kajihara et al.

Affiliated with

Also associated with

Rating

Method of mounting an LSI package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of mounting an LSI package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of mounting an LSI package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-362283